High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions
The demand for chiplet integration using 2.5D and 3D advanced packaging technologies has surged, driven by the exponential growth in computing performance required by artificial intelligence and machine learning (AI/ML). This article reviews these advanced packaging technologies and emphasizes criti...
Saved in:
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
|
| Series: | IEEE Open Journal of the Solid-State Circuits Society |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10767590/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|