High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions

High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions

The demand for chiplet integration using 2.5D and 3D advanced packaging technologies has surged, driven by the exponential growth in computing performance required by artificial intelligence and machine learning (AI/ML). This article reviews these advanced packaging technologies and emphasizes criti...

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Bibliographic Details
Main Authors: Shenggao Li, Mu-Shan Lin, Wei-Chih Chen, Chien-Chun Tsai
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Open Journal of the Solid-State Circuits Society
Subjects:
3Dblox
3D-IC
advanced packaging
artificial intelligence (AI) and compute
chiplet integration
energy efficiency
Online Access:https://ieeexplore.ieee.org/document/10767590/
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https://ieeexplore.ieee.org/document/10767590/

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