Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders

This study discusses an effect of additive elements on crack propagation behaviour for low-Ag contain Sn1.0Ag0.7Cu lead-free solders at high temperature. A cyclic push-pull loading tests for four kinds of Sn1.0Ag0.7Cu solders were conducted at 313 K with a single hole specimen. Stress amplitude of s...

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Bibliographic Details
Main Authors: Noritake Hiyoshi, Mitsuo Yamashita, Hiroaki Hokazono
Format: Article
Language:English
Published: Gruppo Italiano Frattura 2018-09-01
Series:Fracture and Structural Integrity
Subjects:
Online Access:https://www.fracturae.com/index.php/fis/article/view/2033
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