Effect of Additive Elements Bi/Ni/Ge on Crack Initiation and Propagation for Low-Ag Solders
This study discusses an effect of additive elements on crack propagation behaviour for low-Ag contain Sn1.0Ag0.7Cu lead-free solders at high temperature. A cyclic push-pull loading tests for four kinds of Sn1.0Ag0.7Cu solders were conducted at 313 K with a single hole specimen. Stress amplitude of s...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Gruppo Italiano Frattura
2018-09-01
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| Series: | Fracture and Structural Integrity |
| Subjects: | |
| Online Access: | https://www.fracturae.com/index.php/fis/article/view/2033 |
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