Effect of Clip Characteristics on Thermal Performance of Dr.MOS Packages
This study explores the impact of copper clip design on the thermal performance of driver MOSFET (Dr.MOS) packages with the goal of optimizing heat dissipation efficiency in microelectronic components. The study examines four key variables: clip thickness, material, attachment material, and plating...
Saved in:
| Main Authors: | , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
IEEE
2025-01-01
|
| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10845060/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|