A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs

A Foil Flip-Chip Interconnect With an Ultra-Broadband Bandwidth of 130 GHz and Beyond for Heterogeneous High-End System Designs

This paper presents an ultra-broadband, low-loss, flexible liquid crystal polymer substrate-to-substrate interconnect with a bandwidth of more than 130 GHz. The transition discontinuity was minimized by maintaining both the reference impedance and the electromagnetic field conformity across the tran...

Full description

Saved in:
Bibliographic Details
Main Authors: Tim Pfahler, Andre Scheder, Anna Bridier, Mathias Nagel, Martin Vossiek
Format: Article
Language:English
Published: IEEE 2024-01-01
Series:IEEE Journal of Microwaves
Subjects:
Assembly
bond-wire
flip-chip
interconnect
liquid crystal polymer (LCP)
measurement and test
Online Access:https://ieeexplore.ieee.org/document/10557560/
Tags: Add Tag
No Tags, Be the first to tag this record!

Internet

https://ieeexplore.ieee.org/document/10557560/

Similar Items