Li, S., Lin, M., Chen, W., & Tsai, C. High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions. IEEE.
Chicago Style (17th ed.) CitationLi, Shenggao, Mu-Shan Lin, Wei-Chih Chen, and Chien-Chun Tsai. High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions. IEEE.
MLA (9th ed.) CitationLi, Shenggao, et al. High-Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions. IEEE.
Warning: These citations may not always be 100% accurate.