Theoretical and Experimental Study of Copper Electrodeposition in a Modified Hull Cell
The primary current distribution and the resistance of a modified Hull cell are calculated by using conformal mapping technique coupled with numerical evaluation of the resulting integral equations. An approximate analytical expression for the primary current distribution of a modified Hull cell is...
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| Format: | Article |
| Language: | English |
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Wiley
2016-01-01
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| Series: | International Journal of Electrochemistry |
| Online Access: | http://dx.doi.org/10.1155/2016/3482406 |
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| author | Srinivas Palli Suhash R. Dey |
| author_facet | Srinivas Palli Suhash R. Dey |
| author_sort | Srinivas Palli |
| collection | DOAJ |
| description | The primary current distribution and the resistance of a modified Hull cell are calculated by using conformal mapping technique coupled with numerical evaluation of the resulting integral equations. An approximate analytical expression for the primary current distribution of a modified Hull cell is presented. The primary current distribution along the cathode surface is noticed varying in controlled manner as a function of position on the substrate. The current distributions (primary, secondary, and tertiary) in the cell have also been calculated at different applied average current densities (2, 4.1, and 8.2 mA cm−2) through numerical simulation by using finite element based software. The numerical simulation result of the primary current distribution is then compared with the analytical solution and a good match is found. Experimentally, single Cu metal electrodeposition is carried out at different applied average current densities (2, 4.1, and 8.2 mA cm−2) in a modified Hull. The current distribution (primary, secondary, and tertiary) results obtained from the numerical simulation are compared with the experimental results and a satisfactory match is found. Surface morphology of the Cu deposits is examined using scanning electron microscopy (SEM). |
| format | Article |
| id | doaj-art-f85be641fda84f3387cc2880734e1b97 |
| institution | Kabale University |
| issn | 2090-3529 2090-3537 |
| language | English |
| publishDate | 2016-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Electrochemistry |
| spelling | doaj-art-f85be641fda84f3387cc2880734e1b972025-02-03T05:58:43ZengWileyInternational Journal of Electrochemistry2090-35292090-35372016-01-01201610.1155/2016/34824063482406Theoretical and Experimental Study of Copper Electrodeposition in a Modified Hull CellSrinivas Palli0Suhash R. Dey1Department of Materials Science and Metallurgical Engineering, Indian Institute of Technology Hyderabad, Kandi, Sangareddy 502285, IndiaDepartment of Materials Science and Metallurgical Engineering, Indian Institute of Technology Hyderabad, Kandi, Sangareddy 502285, IndiaThe primary current distribution and the resistance of a modified Hull cell are calculated by using conformal mapping technique coupled with numerical evaluation of the resulting integral equations. An approximate analytical expression for the primary current distribution of a modified Hull cell is presented. The primary current distribution along the cathode surface is noticed varying in controlled manner as a function of position on the substrate. The current distributions (primary, secondary, and tertiary) in the cell have also been calculated at different applied average current densities (2, 4.1, and 8.2 mA cm−2) through numerical simulation by using finite element based software. The numerical simulation result of the primary current distribution is then compared with the analytical solution and a good match is found. Experimentally, single Cu metal electrodeposition is carried out at different applied average current densities (2, 4.1, and 8.2 mA cm−2) in a modified Hull. The current distribution (primary, secondary, and tertiary) results obtained from the numerical simulation are compared with the experimental results and a satisfactory match is found. Surface morphology of the Cu deposits is examined using scanning electron microscopy (SEM).http://dx.doi.org/10.1155/2016/3482406 |
| spellingShingle | Srinivas Palli Suhash R. Dey Theoretical and Experimental Study of Copper Electrodeposition in a Modified Hull Cell International Journal of Electrochemistry |
| title | Theoretical and Experimental Study of Copper Electrodeposition in a Modified Hull Cell |
| title_full | Theoretical and Experimental Study of Copper Electrodeposition in a Modified Hull Cell |
| title_fullStr | Theoretical and Experimental Study of Copper Electrodeposition in a Modified Hull Cell |
| title_full_unstemmed | Theoretical and Experimental Study of Copper Electrodeposition in a Modified Hull Cell |
| title_short | Theoretical and Experimental Study of Copper Electrodeposition in a Modified Hull Cell |
| title_sort | theoretical and experimental study of copper electrodeposition in a modified hull cell |
| url | http://dx.doi.org/10.1155/2016/3482406 |
| work_keys_str_mv | AT srinivaspalli theoreticalandexperimentalstudyofcopperelectrodepositioninamodifiedhullcell AT suhashrdey theoreticalandexperimentalstudyofcopperelectrodepositioninamodifiedhullcell |