Microfluidic Cooling System in High-Power Bare Chip Modules Based on New Process Technology
A closed-loop integrated microfluidic cooling system was designed to mitigate the heat dissipation problem in a high-power bare chip. The heat dissipation capabilities of a microchannel manufactured in the cavity and an unmanufactured cavity were compared. Moreover, the heat dissipation capabilities...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Journal of Refrigeration Magazines Agency Co., Ltd.
2023-01-01
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| Series: | Zhileng xuebao |
| Subjects: | |
| Online Access: | http://www.zhilengxuebao.com/thesisDetails#10.3969/j.issn.0253-4339.2023.06.118 |
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