Pressure-Dependent Thermal Network Model for Press-Pack Power Modules with Prognostics of Mechanical Status
The press-pack power module with multi-chip layout has drawn increasing attention from industry and academia with its thermal analysis becoming an essential issue. However, the pressure-dependent thermal variables, such as thermal contact resistance and thermal coupling resistance, are often neglect...
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| Main Authors: | , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
China electric power research institute
2025-01-01
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| Series: | CSEE Journal of Power and Energy Systems |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9713972/ |
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