Comparative Analysis of the Corrosion Behavior of Plain and Nanoporous Copper
This research investigates the corrosion behavior of copper (Cu) through a comprehensive analysis of both plain and nanoporous Cu thin films. A combination of weight-loss methods for quantitative analysis, along with polarization testing and scanning electron microscopy, is employed for both quantit...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2025-01-01
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| Series: | Electrochem |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2673-3293/6/1/1 |
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