Controlled Engineering of Defects and Interfaces in Thermoelectric Materials With Atomic Layer Deposition
Abstract Enhancing the performance of thermoelectric materials remains critical for practical applications. Increasing the power factor and reducing the thermal conductivity are key strategies for improving the thermoelectric performance. Doping, incorporating secondary phases, and generating disloc...
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Wiley-VCH
2025-02-01
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Series: | Advanced Materials Interfaces |
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Online Access: | https://doi.org/10.1002/admi.202400581 |
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author | Gwang Min Park Seunghyeok Lee Tae Joo Park Seung‐Hyub Baek Jin‐Sang Kim Seong Keun Kim |
author_facet | Gwang Min Park Seunghyeok Lee Tae Joo Park Seung‐Hyub Baek Jin‐Sang Kim Seong Keun Kim |
author_sort | Gwang Min Park |
collection | DOAJ |
description | Abstract Enhancing the performance of thermoelectric materials remains critical for practical applications. Increasing the power factor and reducing the thermal conductivity are key strategies for improving the thermoelectric performance. Doping, incorporating secondary phases, and generating dislocations can be used to introduce defects and grain boundaries to improve the thermoelectric performance. The application of an ultrathin film as a coating on thermoelectric materials via atomic layer deposition (ALD) has recently attracted attention as a novel approach to enhance the performance. The excellent conformality of ALD enables the conformal deposition of ultrathin films on powder to enable the interfacial properties to be meticulously controlled even after sintering. Using ALD to deposit an ultrathin layer on the thermoelectric powder matrix induces various defects through the interactions of the coating material with the thermoelectric matrix, which provide exquisite control over the material properties. This review discusses the phenomena induced by applying ultrathin coatings to thermoelectric materials through ALD, elucidates the underlying mechanisms, and examines the effects on the thermoelectric performance. Based on these insights, innovative pathways for applying ALD to thermoelectric materials are proposed, and robust strategies for enhancing these properties through the precise modulation of diverse defects and interfaces are discussed. |
format | Article |
id | doaj-art-ea0e353ccf3b48f2bd0578a9c350cfe9 |
institution | Kabale University |
issn | 2196-7350 |
language | English |
publishDate | 2025-02-01 |
publisher | Wiley-VCH |
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series | Advanced Materials Interfaces |
spelling | doaj-art-ea0e353ccf3b48f2bd0578a9c350cfe92025-02-03T13:24:05ZengWiley-VCHAdvanced Materials Interfaces2196-73502025-02-01123n/an/a10.1002/admi.202400581Controlled Engineering of Defects and Interfaces in Thermoelectric Materials With Atomic Layer DepositionGwang Min Park0Seunghyeok Lee1Tae Joo Park2Seung‐Hyub Baek3Jin‐Sang Kim4Seong Keun Kim5KU‐KIST Graduate School of Converging Science and Technology Korea University Seoul 02841 Republic of KoreaElectronic Materials Research Center Korea Institute of Science and Technology Seoul 02792 Republic of KoreaDepartment of Materials Science and Chemical Engineering Hanyang University Ansan 15588 Republic of KoreaElectronic Materials Research Center Korea Institute of Science and Technology Seoul 02792 Republic of KoreaElectronic Materials Research Center Korea Institute of Science and Technology Seoul 02792 Republic of KoreaKU‐KIST Graduate School of Converging Science and Technology Korea University Seoul 02841 Republic of KoreaAbstract Enhancing the performance of thermoelectric materials remains critical for practical applications. Increasing the power factor and reducing the thermal conductivity are key strategies for improving the thermoelectric performance. Doping, incorporating secondary phases, and generating dislocations can be used to introduce defects and grain boundaries to improve the thermoelectric performance. The application of an ultrathin film as a coating on thermoelectric materials via atomic layer deposition (ALD) has recently attracted attention as a novel approach to enhance the performance. The excellent conformality of ALD enables the conformal deposition of ultrathin films on powder to enable the interfacial properties to be meticulously controlled even after sintering. Using ALD to deposit an ultrathin layer on the thermoelectric powder matrix induces various defects through the interactions of the coating material with the thermoelectric matrix, which provide exquisite control over the material properties. This review discusses the phenomena induced by applying ultrathin coatings to thermoelectric materials through ALD, elucidates the underlying mechanisms, and examines the effects on the thermoelectric performance. Based on these insights, innovative pathways for applying ALD to thermoelectric materials are proposed, and robust strategies for enhancing these properties through the precise modulation of diverse defects and interfaces are discussed.https://doi.org/10.1002/admi.202400581atomic layer depositiondefectsinterfacesthermoelectric materials |
spellingShingle | Gwang Min Park Seunghyeok Lee Tae Joo Park Seung‐Hyub Baek Jin‐Sang Kim Seong Keun Kim Controlled Engineering of Defects and Interfaces in Thermoelectric Materials With Atomic Layer Deposition Advanced Materials Interfaces atomic layer deposition defects interfaces thermoelectric materials |
title | Controlled Engineering of Defects and Interfaces in Thermoelectric Materials With Atomic Layer Deposition |
title_full | Controlled Engineering of Defects and Interfaces in Thermoelectric Materials With Atomic Layer Deposition |
title_fullStr | Controlled Engineering of Defects and Interfaces in Thermoelectric Materials With Atomic Layer Deposition |
title_full_unstemmed | Controlled Engineering of Defects and Interfaces in Thermoelectric Materials With Atomic Layer Deposition |
title_short | Controlled Engineering of Defects and Interfaces in Thermoelectric Materials With Atomic Layer Deposition |
title_sort | controlled engineering of defects and interfaces in thermoelectric materials with atomic layer deposition |
topic | atomic layer deposition defects interfaces thermoelectric materials |
url | https://doi.org/10.1002/admi.202400581 |
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