EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER

EFFECT OF DIE ADHESIVE ON THE PERFORMANCE OF HIGH-G MEMS ACCELEROMETER

The sensitivity and reliability of packaged high-g MEMS accelerometer strongly depends on die attach quality that should pay special attention in the operation. A package method based on die attach is presented for a prepared MEMS high-g accelerometers by using two die attach adhesives with differen...

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Bibliographic Details
Main Authors: GUO HuiYu, WEN Feng, KANG Qiang, SHI YunBo, WANG YanYang
Format: Article
Language:zho
Published: Editorial Office of Journal of Mechanical Strength 2018-01-01
Series:Jixie qiangdu
Subjects:
Packaging
Die process
High-g MEMS accelerometer
Elastic modulus
Finite element analysis（FEA）
Hopkinson Bar
Online Access:http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2018.01.015
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http://www.jxqd.net.cn/thesisDetails#10.16579/j.issn.1001.9669.2018.01.015

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