A Study of Isothermal Curing of PMI Using DMA
The isothermal curing of polymethacrylimide (PMI) is studied through the use of dynamic mechanical analysis (DMA). Based on the growth rate of measured dynamic mechanical property, the relative conversion is defined to investigate the evolution of storage modulus E′ at different curing temperatures....
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Main Authors: | Jing Zhang, Rui Ye, Jun Zou, Jijun Tang, Hongliang Wang |
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Format: | Article |
Language: | English |
Published: |
Wiley
2015-01-01
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Series: | Advances in Materials Science and Engineering |
Online Access: | http://dx.doi.org/10.1155/2015/695286 |
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