Adhesion Testing of Direct-Write Printed Ink on Metallic Structural Components
The successful adoption of additive manufacturing for the rapid prototyping of direct-write printed electronics requires the establishment of quantifiable metrics. These metrics should directly interrogate the fabrication quality of the device during the manufacturing process. This implies that the...
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IEEE
2025-01-01
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| Series: | IEEE Open Journal of Instrumentation and Measurement |
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| Online Access: | https://ieeexplore.ieee.org/document/10804879/ |
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| author | Timothy L. Phero Amey R. Khanolkar James A. Smith Bradley C. Benefiel Shaun P. Evans Michael D. McMurtrey David Estrada Brian J. Jaques |
| author_facet | Timothy L. Phero Amey R. Khanolkar James A. Smith Bradley C. Benefiel Shaun P. Evans Michael D. McMurtrey David Estrada Brian J. Jaques |
| author_sort | Timothy L. Phero |
| collection | DOAJ |
| description | The successful adoption of additive manufacturing for the rapid prototyping of direct-write printed electronics requires the establishment of quantifiable metrics. These metrics should directly interrogate the fabrication quality of the device during the manufacturing process. This implies that the characterization technique should be nondestructive. One measure of fabrication performance is the adhesion strength between the substrate and printed film interface, which is critical since the strength of this interface can dictate the accuracy and reliability of the printed device. In this work, a noncontact laser-induced spallation technique has been used to estimate the adhesion of silver-printed films on aluminum alloy substrates. The laser-based method was compared to a standardized pull-off adhesion test, which provided baseline measurements of adhesion strength. These adhesion measurement techniques were compared against the sintering condition-dependent microstructure of the additive manufacturing films. The porous structure of the printed thin film was found to be an important factor that impacted adhesion tests that utilize adhesives (i.e., glue and resins) due to an enhanced interlocking to the adherend surface. Due to its noncontact nature and insensitivity to thin samples/films, laser spallation was found to be a more reliable indication of process parameter change. The methods and results described in this work support the establishment of process control steps that are necessary for quickly verifying the reliability of printed devices prior to their deployment in critical experiments. |
| format | Article |
| id | doaj-art-e3c6b5b57c5f42ca96fd7210666a13f7 |
| institution | Kabale University |
| issn | 2768-7236 |
| language | English |
| publishDate | 2025-01-01 |
| publisher | IEEE |
| record_format | Article |
| series | IEEE Open Journal of Instrumentation and Measurement |
| spelling | doaj-art-e3c6b5b57c5f42ca96fd7210666a13f72025-01-25T00:03:52ZengIEEEIEEE Open Journal of Instrumentation and Measurement2768-72362025-01-01411510.1109/OJIM.2024.351762210804879Adhesion Testing of Direct-Write Printed Ink on Metallic Structural ComponentsTimothy L. Phero0https://orcid.org/0000-0002-1528-9172Amey R. Khanolkar1https://orcid.org/0000-0003-0816-5507James A. Smith2https://orcid.org/0000-0002-4450-8573Bradley C. Benefiel3https://orcid.org/0009-0004-8412-4381Shaun P. Evans4https://orcid.org/0009-0001-2625-5453Michael D. McMurtrey5https://orcid.org/0000-0002-7835-2888David Estrada6https://orcid.org/0000-0001-5894-0773Brian J. Jaques7https://orcid.org/0000-0002-5324-555XMicron School of Materials Science and Engineering, Boise State University, Boise, ID, USAIdaho National Laboratory, Energy and Environment Science and Technology, Idaho Falls, ID, USAIdaho National Laboratory, Idaho Falls, ID, USAIdaho National Laboratory, Idaho Falls, ID, USAIdaho National Laboratory, Idaho Falls, ID, USAIdaho National Laboratory, Idaho Falls, ID, USAMicron School of Materials Science and Engineering, Boise State University, Boise, ID, USAMicron School of Materials Science and Engineering, Boise State University, Boise, ID, USAThe successful adoption of additive manufacturing for the rapid prototyping of direct-write printed electronics requires the establishment of quantifiable metrics. These metrics should directly interrogate the fabrication quality of the device during the manufacturing process. This implies that the characterization technique should be nondestructive. One measure of fabrication performance is the adhesion strength between the substrate and printed film interface, which is critical since the strength of this interface can dictate the accuracy and reliability of the printed device. In this work, a noncontact laser-induced spallation technique has been used to estimate the adhesion of silver-printed films on aluminum alloy substrates. The laser-based method was compared to a standardized pull-off adhesion test, which provided baseline measurements of adhesion strength. These adhesion measurement techniques were compared against the sintering condition-dependent microstructure of the additive manufacturing films. The porous structure of the printed thin film was found to be an important factor that impacted adhesion tests that utilize adhesives (i.e., glue and resins) due to an enhanced interlocking to the adherend surface. Due to its noncontact nature and insensitivity to thin samples/films, laser spallation was found to be a more reliable indication of process parameter change. The methods and results described in this work support the establishment of process control steps that are necessary for quickly verifying the reliability of printed devices prior to their deployment in critical experiments.https://ieeexplore.ieee.org/document/10804879/Additive manufacturing (AM)adhesion testinglaser spallationprinted electronicspull-off adhesionqualification testing |
| spellingShingle | Timothy L. Phero Amey R. Khanolkar James A. Smith Bradley C. Benefiel Shaun P. Evans Michael D. McMurtrey David Estrada Brian J. Jaques Adhesion Testing of Direct-Write Printed Ink on Metallic Structural Components IEEE Open Journal of Instrumentation and Measurement Additive manufacturing (AM) adhesion testing laser spallation printed electronics pull-off adhesion qualification testing |
| title | Adhesion Testing of Direct-Write Printed Ink on Metallic Structural Components |
| title_full | Adhesion Testing of Direct-Write Printed Ink on Metallic Structural Components |
| title_fullStr | Adhesion Testing of Direct-Write Printed Ink on Metallic Structural Components |
| title_full_unstemmed | Adhesion Testing of Direct-Write Printed Ink on Metallic Structural Components |
| title_short | Adhesion Testing of Direct-Write Printed Ink on Metallic Structural Components |
| title_sort | adhesion testing of direct write printed ink on metallic structural components |
| topic | Additive manufacturing (AM) adhesion testing laser spallation printed electronics pull-off adhesion qualification testing |
| url | https://ieeexplore.ieee.org/document/10804879/ |
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