A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages
This paper investigates a novel X-band microstrip-to-microstrip vertical via transition with matching pads loaded signal via. This design has been proposed for a multilayer substrate package. The matching pads, which are located in the center of the signal via on each ground layer, are adopted to fu...
Saved in:
| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2016-01-01
|
| Series: | International Journal of Antennas and Propagation |
| Online Access: | http://dx.doi.org/10.1155/2016/9562854 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|