Research on BHAST Test Method for Plastic Encapsulated Microcircuit

Research on BHAST Test Method for Plastic Encapsulated Microcircuit

Compared to metal packaging and ceramic packaging, plastic encapsulated microcircuits (PEMs) have the advantages of light weight and low cost. However, due to their non-airtightness, they are prone to delamination, corrosion, and other failures in humid and hot environments. In engineering practice,...

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Bibliographic Details
Main Authors: Yuege Zhou, Bo Wan, Qingsheng Liu, Jingyang Zhong, Shupeng Li, Tengfei Ma, Wei Guo
Format: Article
Language:English
Published: IEEE 2025-01-01
Series:IEEE Access
Subjects:
Plastic encapsulated microcircuit (PEM)
biased highly accelerated stress test (BHAST)
bias voltage
corrosion
failure analysis
Online Access:https://ieeexplore.ieee.org/document/10820332/
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https://ieeexplore.ieee.org/document/10820332/

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