Cyclic bend tests for the reliability evaluation of printed circuit boards under dynamic loads
The reliability of printed circuit boards under dynamic loads is a key issue in the handheld electronic products industry. In order to predict the performance of the boards in their application lifetime, different tests were developed. The current industry-wide standard testing method is a board lev...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Gruppo Italiano Frattura
2011-01-01
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| Series: | Fracture and Structural Integrity |
| Subjects: | |
| Online Access: | http://www.gruppofrattura.it/pdf/rivista/numero15/numero_15_art_7.pdf |
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