Deformation Fields Measurement of Crack Tip under High-Frequency Resonant Loading Using a Novel Hybrid Image Processing Method

A novel hybrid image processing method is proposed to obtain the crack tip location, crack propagation path, displacement, strain fields, and plastic zone size of crack tip region under high-frequency resonant loading in this paper. An ordinary CCD camera is used to collect a series of crack images...

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Main Authors: Hongli Gao, Zhaonian Zhang, Wei Jiang, Kaiyong Zhu, Ao Gong
Format: Article
Language:English
Published: Wiley 2018-01-01
Series:Shock and Vibration
Online Access:http://dx.doi.org/10.1155/2018/1928926
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author Hongli Gao
Zhaonian Zhang
Wei Jiang
Kaiyong Zhu
Ao Gong
author_facet Hongli Gao
Zhaonian Zhang
Wei Jiang
Kaiyong Zhu
Ao Gong
author_sort Hongli Gao
collection DOAJ
description A novel hybrid image processing method is proposed to obtain the crack tip location, crack propagation path, displacement, strain fields, and plastic zone size of crack tip region under high-frequency resonant loading in this paper. An ordinary CCD camera is used to collect a series of crack images on one side of the compact tension (CT) specimen; meanwhile, a high-speed digital camera is used to acquire a series of digital speckle images of the other side of the specimen under the loading conditions at regular time intervals. Digital image processing (DIP) method is used to determine the macroscopic crack position. Digital image correlation (DIC) method is applied to obtain the displacement, strain fields, and plastic zone size of crack tip region. The characteristic digital speckle images of one stress cycle are obtained by data fitting and image matching method. Accordingly, the displacement/strain fields of crack tip region within one stress cycle and the displacement and strain amplitude fields with different crack lengths are obtained and analyzed. The obtained results are compared with the measured results of ordinary methods and show a good match. The success of this method will help to obtain better insight into and understanding of the fatigue and failure behavior of metal material with mode I crack under high-frequency resonant loading.
format Article
id doaj-art-d331e5e6890a42068b6ba4f6eedf779f
institution Kabale University
issn 1070-9622
1875-9203
language English
publishDate 2018-01-01
publisher Wiley
record_format Article
series Shock and Vibration
spelling doaj-art-d331e5e6890a42068b6ba4f6eedf779f2025-02-03T05:50:08ZengWileyShock and Vibration1070-96221875-92032018-01-01201810.1155/2018/19289261928926Deformation Fields Measurement of Crack Tip under High-Frequency Resonant Loading Using a Novel Hybrid Image Processing MethodHongli Gao0Zhaonian Zhang1Wei Jiang2Kaiyong Zhu3Ao Gong4College of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, Zhejiang 310014, ChinaCollege of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, Zhejiang 310014, ChinaCollege of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, Zhejiang 310014, ChinaCollege of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, Zhejiang 310014, ChinaCollege of Mechanical Engineering, Zhejiang University of Technology, Hangzhou, Zhejiang 310014, ChinaA novel hybrid image processing method is proposed to obtain the crack tip location, crack propagation path, displacement, strain fields, and plastic zone size of crack tip region under high-frequency resonant loading in this paper. An ordinary CCD camera is used to collect a series of crack images on one side of the compact tension (CT) specimen; meanwhile, a high-speed digital camera is used to acquire a series of digital speckle images of the other side of the specimen under the loading conditions at regular time intervals. Digital image processing (DIP) method is used to determine the macroscopic crack position. Digital image correlation (DIC) method is applied to obtain the displacement, strain fields, and plastic zone size of crack tip region. The characteristic digital speckle images of one stress cycle are obtained by data fitting and image matching method. Accordingly, the displacement/strain fields of crack tip region within one stress cycle and the displacement and strain amplitude fields with different crack lengths are obtained and analyzed. The obtained results are compared with the measured results of ordinary methods and show a good match. The success of this method will help to obtain better insight into and understanding of the fatigue and failure behavior of metal material with mode I crack under high-frequency resonant loading.http://dx.doi.org/10.1155/2018/1928926
spellingShingle Hongli Gao
Zhaonian Zhang
Wei Jiang
Kaiyong Zhu
Ao Gong
Deformation Fields Measurement of Crack Tip under High-Frequency Resonant Loading Using a Novel Hybrid Image Processing Method
Shock and Vibration
title Deformation Fields Measurement of Crack Tip under High-Frequency Resonant Loading Using a Novel Hybrid Image Processing Method
title_full Deformation Fields Measurement of Crack Tip under High-Frequency Resonant Loading Using a Novel Hybrid Image Processing Method
title_fullStr Deformation Fields Measurement of Crack Tip under High-Frequency Resonant Loading Using a Novel Hybrid Image Processing Method
title_full_unstemmed Deformation Fields Measurement of Crack Tip under High-Frequency Resonant Loading Using a Novel Hybrid Image Processing Method
title_short Deformation Fields Measurement of Crack Tip under High-Frequency Resonant Loading Using a Novel Hybrid Image Processing Method
title_sort deformation fields measurement of crack tip under high frequency resonant loading using a novel hybrid image processing method
url http://dx.doi.org/10.1155/2018/1928926
work_keys_str_mv AT hongligao deformationfieldsmeasurementofcracktipunderhighfrequencyresonantloadingusinganovelhybridimageprocessingmethod
AT zhaonianzhang deformationfieldsmeasurementofcracktipunderhighfrequencyresonantloadingusinganovelhybridimageprocessingmethod
AT weijiang deformationfieldsmeasurementofcracktipunderhighfrequencyresonantloadingusinganovelhybridimageprocessingmethod
AT kaiyongzhu deformationfieldsmeasurementofcracktipunderhighfrequencyresonantloadingusinganovelhybridimageprocessingmethod
AT aogong deformationfieldsmeasurementofcracktipunderhighfrequencyresonantloadingusinganovelhybridimageprocessingmethod