Hot Deformation Behavior and Workability Characteristic of SiCp/Al-Cu-Mg-Ag Composite
The hot deformation behaviors of the 20wt% SiCp/Al-Cu-Mg-Ag composite were studied by establishing processing map and characterizing the microstructure evolution. The hot deformation behavior of the SiCp/Al-Cu-Mg-Ag composite was analyzed through stress-strain curves, and a constitutive equation for...
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Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol)
2025-01-01
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Series: | Materials Research |
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Online Access: | http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392024000100321&lng=en&tlng=en |
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author | Ning Li Zhenlin Zhang Ying Xiao Kecai Liu Jin Nie Fengliang Tan |
author_facet | Ning Li Zhenlin Zhang Ying Xiao Kecai Liu Jin Nie Fengliang Tan |
author_sort | Ning Li |
collection | DOAJ |
description | The hot deformation behaviors of the 20wt% SiCp/Al-Cu-Mg-Ag composite were studied by establishing processing map and characterizing the microstructure evolution. The hot deformation behavior of the SiCp/Al-Cu-Mg-Ag composite was analyzed through stress-strain curves, and a constitutive equation for its hot deformation was established. Based on the dynamic material model, a processing map for the composite was constructed. The results indicate that the true stress decreases rapidly with increasing temperature and tends to stabilize or slightly decrease after reaching its peak. Furthermore, the peak stress increases with decreasing deformation temperature or increasing strain rate. The flow stress behavior of the SiCp/Al-Cu-Mg-Ag composites can be described by a hyperbolic Arrhenius equation, with a heat activation energy (Q) of 222.3 kJ/mol. The SiCp/Al-Cu-Mg-Ag composite can be deformed stably in the high-temperature, low-strain-rate region. The optimal deformation conditions are identified as 475-500°C and 0.01-0.1s-1, with a maximum dissipation efficiency of 34%. |
format | Article |
id | doaj-art-d0fc15d2539546f0b32b41f42d5a107e |
institution | Kabale University |
issn | 1516-1439 |
language | English |
publishDate | 2025-01-01 |
publisher | Associação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol) |
record_format | Article |
series | Materials Research |
spelling | doaj-art-d0fc15d2539546f0b32b41f42d5a107e2025-02-04T07:38:42ZengAssociação Brasileira de Metalurgia e Materiais (ABM); Associação Brasileira de Cerâmica (ABC); Associação Brasileira de Polímeros (ABPol)Materials Research1516-14392025-01-012710.1590/1980-5373-mr-2024-0337Hot Deformation Behavior and Workability Characteristic of SiCp/Al-Cu-Mg-Ag CompositeNing LiZhenlin Zhanghttps://orcid.org/0000-0002-5655-5369Ying XiaoKecai LiuJin NieFengliang TanThe hot deformation behaviors of the 20wt% SiCp/Al-Cu-Mg-Ag composite were studied by establishing processing map and characterizing the microstructure evolution. The hot deformation behavior of the SiCp/Al-Cu-Mg-Ag composite was analyzed through stress-strain curves, and a constitutive equation for its hot deformation was established. Based on the dynamic material model, a processing map for the composite was constructed. The results indicate that the true stress decreases rapidly with increasing temperature and tends to stabilize or slightly decrease after reaching its peak. Furthermore, the peak stress increases with decreasing deformation temperature or increasing strain rate. The flow stress behavior of the SiCp/Al-Cu-Mg-Ag composites can be described by a hyperbolic Arrhenius equation, with a heat activation energy (Q) of 222.3 kJ/mol. The SiCp/Al-Cu-Mg-Ag composite can be deformed stably in the high-temperature, low-strain-rate region. The optimal deformation conditions are identified as 475-500°C and 0.01-0.1s-1, with a maximum dissipation efficiency of 34%.http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392024000100321&lng=en&tlng=enSiCp/Al compositeHot deformationProcessing mapDeformation activation energy |
spellingShingle | Ning Li Zhenlin Zhang Ying Xiao Kecai Liu Jin Nie Fengliang Tan Hot Deformation Behavior and Workability Characteristic of SiCp/Al-Cu-Mg-Ag Composite Materials Research SiCp/Al composite Hot deformation Processing map Deformation activation energy |
title | Hot Deformation Behavior and Workability Characteristic of SiCp/Al-Cu-Mg-Ag Composite |
title_full | Hot Deformation Behavior and Workability Characteristic of SiCp/Al-Cu-Mg-Ag Composite |
title_fullStr | Hot Deformation Behavior and Workability Characteristic of SiCp/Al-Cu-Mg-Ag Composite |
title_full_unstemmed | Hot Deformation Behavior and Workability Characteristic of SiCp/Al-Cu-Mg-Ag Composite |
title_short | Hot Deformation Behavior and Workability Characteristic of SiCp/Al-Cu-Mg-Ag Composite |
title_sort | hot deformation behavior and workability characteristic of sicp al cu mg ag composite |
topic | SiCp/Al composite Hot deformation Processing map Deformation activation energy |
url | http://www.scielo.br/scielo.php?script=sci_arttext&pid=S1516-14392024000100321&lng=en&tlng=en |
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