Modeling of ACF–COG Interconnection Resistance and Optimization of Process Parameters
The chip-on-glass process is a core technology in the production of liquid crystal displays, primarily utilizing thermosetting curing glue and various conductive particles within anisotropic conductive adhesive film to achieve interconnection. The resistance of the chip after interconnection serves...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Editorial Department of Journal of Sichuan University (Engineering Science Edition)
2024-09-01
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| Series: | 工程科学与技术 |
| Subjects: | |
| Online Access: | http://jsuese.scu.edu.cn/thesisDetails#10.15961/j.jsuese.202201338 |
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