Unified constitutive modeling for hot tensile behavior of TC4 alloy with and without diffusion bonding joint

The hot deformation and fracture behavior of TC4 with and without diffusion bonding (DB) are investigated in both experimental and numerical methods in this study. The hot tensile tests of TC4 specimens with and without DB have been carried out at a temperature of 750 °C and strain rate of 0.1–0.000...

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Bibliographic Details
Main Authors: Zhongman Cai, Yong Li, Yanqiang Xu, Jiarui Chen, Xiaoxing Li, Guanglu Ma, Dongsheng Li
Format: Article
Language:English
Published: Elsevier 2025-03-01
Series:Journal of Materials Research and Technology
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Online Access:http://www.sciencedirect.com/science/article/pii/S2238785425000146
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