Approximating the Impedance Profile of Multilayer Reference Plane Cut-Out Compensation up to Ka-Band
This paper addresses and solves a problem finding the reference plane impedance compensation impedance profile using a modified logistic function approximation and avoiding both the search for complex fringe capacitance equations, when the reference plane impedance compensation cut-out is larger tha...
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| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2024-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/10767239/ |
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| Summary: | This paper addresses and solves a problem finding the reference plane impedance compensation impedance profile using a modified logistic function approximation and avoiding both the search for complex fringe capacitance equations, when the reference plane impedance compensation cut-out is larger than the cut-out, and solving Maxwell’s equations using finite element methods. The proposed approximation method allows designers and researchers to estimate the optimal width of the cut-out for each specific PCB stack-up and layout density case without the need of heavy computational power and specific CAD software tools. The proposed method is applicable to multiple-layer cut-out compensation with different dielectric height ratios. A full mathematical description along with multiple examples is provided, including practical measurements up to the Ka-band. The goodness of fit between the calculated and the approximated impedance value plots is R<inline-formula> <tex-math notation="LaTeX">$^{2} = 0.975$ </tex-math></inline-formula>, while the measured discontinuity impedance values are within and less than 5% tolerance. The measured reference plane cut-out compensation improved the impedance of the discontinuities by up to <inline-formula> <tex-math notation="LaTeX">$30~\Omega $ </tex-math></inline-formula>. |
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| ISSN: | 2169-3536 |