Evaluation of Solidification and Interfacial Reaction of Sn-Bi and Sn-Bi-In Solder Alloys in Copper and Nickel Interfaces
Although there are studies devoted to lower Indium (In) addition, Sn-Bi alloys containing 10 wt.% In or more have been barely investigated so far. Higher In contents may offer the potential for improved joint production, better control over the growth of interfacial layers, and enhanced mechanical s...
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| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2024-08-01
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| Series: | Metals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2075-4701/14/9/963 |
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