Effect of Titanium Addition on the Thermal Properties of Diamond/Cu-Ti Composites Fabricated by Pressureless Liquid-Phase Sintering Technique
In this study, minor-addition elements such as Si, Co, Cr, W, Mo, and Ti were added to matrix to improve the wettability between the diamonds and Cu matrix. The pressureless liquid-phase sintering technique adopted in this study provides a low-cost method for producing diamond/Cu composites with hig...
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Language: | English |
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Wiley
2014-01-01
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Series: | The Scientific World Journal |
Online Access: | http://dx.doi.org/10.1155/2014/713537 |
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author | Chih-Yu Chung Chao-Hung Chu Mu-Tse Lee Chun-Ming Lin Su-Jien Lin |
author_facet | Chih-Yu Chung Chao-Hung Chu Mu-Tse Lee Chun-Ming Lin Su-Jien Lin |
author_sort | Chih-Yu Chung |
collection | DOAJ |
description | In this study, minor-addition elements such as Si, Co, Cr, W, Mo, and Ti were added to matrix to improve the wettability between the diamonds and Cu matrix. The pressureless liquid-phase sintering technique adopted in this study provides a low-cost method for producing diamond/Cu composites with high potential for industrial mass production. Thermal properties of the diamond/Cu-Ti composites fabricated by pressureless liquid-phase sintering at 1373 K with variation in Ti contents were thoroughly investigated. XRD and TEM analysis show that TiC layer formed in the interface between Cu and diamond. The composites exhibited thermal conductivity as high as 620 W/m·K for 50 vol% diamond/Cu-0.6 at % Ti composite with diamond particle size of 300 µm. This value comes up to 85% of the thermal conductivity calculated by the Hasselman and Johnson (H-J) theoretical analysis. Under these conditions, a suitable coefficient of thermal expansion of 6.9 ppm/K was obtained. |
format | Article |
id | doaj-art-bdeac248765e40338c7955dbb79f1a53 |
institution | Kabale University |
issn | 2356-6140 1537-744X |
language | English |
publishDate | 2014-01-01 |
publisher | Wiley |
record_format | Article |
series | The Scientific World Journal |
spelling | doaj-art-bdeac248765e40338c7955dbb79f1a532025-02-03T05:43:38ZengWileyThe Scientific World Journal2356-61401537-744X2014-01-01201410.1155/2014/713537713537Effect of Titanium Addition on the Thermal Properties of Diamond/Cu-Ti Composites Fabricated by Pressureless Liquid-Phase Sintering TechniqueChih-Yu Chung0Chao-Hung Chu1Mu-Tse Lee2Chun-Ming Lin3Su-Jien Lin4Department of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, TaiwanDepartment of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, TaiwanDepartment of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, TaiwanDepartment of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, TaiwanDepartment of Materials Science and Engineering, National Tsing Hua University, Hsinchu 30013, TaiwanIn this study, minor-addition elements such as Si, Co, Cr, W, Mo, and Ti were added to matrix to improve the wettability between the diamonds and Cu matrix. The pressureless liquid-phase sintering technique adopted in this study provides a low-cost method for producing diamond/Cu composites with high potential for industrial mass production. Thermal properties of the diamond/Cu-Ti composites fabricated by pressureless liquid-phase sintering at 1373 K with variation in Ti contents were thoroughly investigated. XRD and TEM analysis show that TiC layer formed in the interface between Cu and diamond. The composites exhibited thermal conductivity as high as 620 W/m·K for 50 vol% diamond/Cu-0.6 at % Ti composite with diamond particle size of 300 µm. This value comes up to 85% of the thermal conductivity calculated by the Hasselman and Johnson (H-J) theoretical analysis. Under these conditions, a suitable coefficient of thermal expansion of 6.9 ppm/K was obtained.http://dx.doi.org/10.1155/2014/713537 |
spellingShingle | Chih-Yu Chung Chao-Hung Chu Mu-Tse Lee Chun-Ming Lin Su-Jien Lin Effect of Titanium Addition on the Thermal Properties of Diamond/Cu-Ti Composites Fabricated by Pressureless Liquid-Phase Sintering Technique The Scientific World Journal |
title | Effect of Titanium Addition on the Thermal Properties of Diamond/Cu-Ti Composites Fabricated by Pressureless Liquid-Phase Sintering Technique |
title_full | Effect of Titanium Addition on the Thermal Properties of Diamond/Cu-Ti Composites Fabricated by Pressureless Liquid-Phase Sintering Technique |
title_fullStr | Effect of Titanium Addition on the Thermal Properties of Diamond/Cu-Ti Composites Fabricated by Pressureless Liquid-Phase Sintering Technique |
title_full_unstemmed | Effect of Titanium Addition on the Thermal Properties of Diamond/Cu-Ti Composites Fabricated by Pressureless Liquid-Phase Sintering Technique |
title_short | Effect of Titanium Addition on the Thermal Properties of Diamond/Cu-Ti Composites Fabricated by Pressureless Liquid-Phase Sintering Technique |
title_sort | effect of titanium addition on the thermal properties of diamond cu ti composites fabricated by pressureless liquid phase sintering technique |
url | http://dx.doi.org/10.1155/2014/713537 |
work_keys_str_mv | AT chihyuchung effectoftitaniumadditiononthethermalpropertiesofdiamondcuticompositesfabricatedbypressurelessliquidphasesinteringtechnique AT chaohungchu effectoftitaniumadditiononthethermalpropertiesofdiamondcuticompositesfabricatedbypressurelessliquidphasesinteringtechnique AT mutselee effectoftitaniumadditiononthethermalpropertiesofdiamondcuticompositesfabricatedbypressurelessliquidphasesinteringtechnique AT chunminglin effectoftitaniumadditiononthethermalpropertiesofdiamondcuticompositesfabricatedbypressurelessliquidphasesinteringtechnique AT sujienlin effectoftitaniumadditiononthethermalpropertiesofdiamondcuticompositesfabricatedbypressurelessliquidphasesinteringtechnique |