Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages
This paper presents a new method to suppress the electromagnetic radiation between the heatsink and packaging substrate in the system-in-package by using a resistance film absorber. The proposed absorber is designed with the indium tin oxide sputtered on both sides of the glass substrate, and the to...
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| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
2022-01-01
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| Series: | International Journal of Antennas and Propagation |
| Online Access: | http://dx.doi.org/10.1155/2022/7674970 |
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