Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages

This paper presents a new method to suppress the electromagnetic radiation between the heatsink and packaging substrate in the system-in-package by using a resistance film absorber. The proposed absorber is designed with the indium tin oxide sputtered on both sides of the glass substrate, and the to...

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Bibliographic Details
Main Authors: Shuyun Huo, Yan Li, Xiaoyong Lei, Zhe Sun, Heyuan Yu, Bingheng Li, Lidan Fang, Shaojie Xu, Ning Jin, Erping Li
Format: Article
Language:English
Published: Wiley 2022-01-01
Series:International Journal of Antennas and Propagation
Online Access:http://dx.doi.org/10.1155/2022/7674970
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