Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages
This paper presents a new method to suppress the electromagnetic radiation between the heatsink and packaging substrate in the system-in-package by using a resistance film absorber. The proposed absorber is designed with the indium tin oxide sputtered on both sides of the glass substrate, and the to...
Saved in:
| Main Authors: | , , , , , , , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Wiley
2022-01-01
|
| Series: | International Journal of Antennas and Propagation |
| Online Access: | http://dx.doi.org/10.1155/2022/7674970 |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
| _version_ | 1832563938383888384 |
|---|---|
| author | Shuyun Huo Yan Li Xiaoyong Lei Zhe Sun Heyuan Yu Bingheng Li Lidan Fang Shaojie Xu Ning Jin Erping Li |
| author_facet | Shuyun Huo Yan Li Xiaoyong Lei Zhe Sun Heyuan Yu Bingheng Li Lidan Fang Shaojie Xu Ning Jin Erping Li |
| author_sort | Shuyun Huo |
| collection | DOAJ |
| description | This paper presents a new method to suppress the electromagnetic radiation between the heatsink and packaging substrate in the system-in-package by using a resistance film absorber. The proposed absorber is designed with the indium tin oxide sputtered on both sides of the glass substrate, and the top layer adopts the combination of Jerusalem cross-shaped, ring-shaped, and L-shaped resistive film to expand the bandwidth. The unit size of the absorber is 0.14λL×0.14λL and the thickness is 0.049 λL. It has an absorptivity of more than 90% in the frequency range of 21 GHz to 55 GHz with polarization insensitivity, and angular stability. Moreover, the radiated electric field from the chip package at 3 m is significantly reduced when employing the proposed absorber, and the maximum suppression of the electric field reaches 18 dB. Finally, the measurement results are carried out to verify the simulation results. Both simulation and experiment results demonstrate that the proposed absorber has excellent radiation suppression, which can be properly applied to electromagnetic interference suppression of the printed circuit board. |
| format | Article |
| id | doaj-art-bba84ccc008f406ca8c07864bce1f0d6 |
| institution | Kabale University |
| issn | 1687-5877 |
| language | English |
| publishDate | 2022-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | International Journal of Antennas and Propagation |
| spelling | doaj-art-bba84ccc008f406ca8c07864bce1f0d62025-02-03T01:12:10ZengWileyInternational Journal of Antennas and Propagation1687-58772022-01-01202210.1155/2022/7674970Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-PackagesShuyun Huo0Yan Li1Xiaoyong Lei2Zhe Sun3Heyuan Yu4Bingheng Li5Lidan Fang6Shaojie Xu7Ning Jin8Erping Li9The School of Electronics and Information EngineeringKey Laboratory of Electromagnetic Wave Information Technology and Metrology of Zhejiang ProvinceThe School of Electronics and Information EngineeringThe School of Electronics and Information EngineeringThe School of Electronics and Information EngineeringThe Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems and ApplicationsKey Laboratory of Electromagnetic Wave Information Technology and Metrology of Zhejiang ProvinceKey Laboratory of Electromagnetic Wave Information Technology and Metrology of Zhejiang ProvinceKey Laboratory of Electromagnetic Wave Information Technology and Metrology of Zhejiang ProvinceThe Key Laboratory of Advanced Micro-Nano Electronic Devices and Smart Systems and ApplicationsThis paper presents a new method to suppress the electromagnetic radiation between the heatsink and packaging substrate in the system-in-package by using a resistance film absorber. The proposed absorber is designed with the indium tin oxide sputtered on both sides of the glass substrate, and the top layer adopts the combination of Jerusalem cross-shaped, ring-shaped, and L-shaped resistive film to expand the bandwidth. The unit size of the absorber is 0.14λL×0.14λL and the thickness is 0.049 λL. It has an absorptivity of more than 90% in the frequency range of 21 GHz to 55 GHz with polarization insensitivity, and angular stability. Moreover, the radiated electric field from the chip package at 3 m is significantly reduced when employing the proposed absorber, and the maximum suppression of the electric field reaches 18 dB. Finally, the measurement results are carried out to verify the simulation results. Both simulation and experiment results demonstrate that the proposed absorber has excellent radiation suppression, which can be properly applied to electromagnetic interference suppression of the printed circuit board.http://dx.doi.org/10.1155/2022/7674970 |
| spellingShingle | Shuyun Huo Yan Li Xiaoyong Lei Zhe Sun Heyuan Yu Bingheng Li Lidan Fang Shaojie Xu Ning Jin Erping Li Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages International Journal of Antennas and Propagation |
| title | Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages |
| title_full | Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages |
| title_fullStr | Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages |
| title_full_unstemmed | Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages |
| title_short | Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages |
| title_sort | analysis of a novel resistive film absorber for suppression of electromagnetic radiation in system in packages |
| url | http://dx.doi.org/10.1155/2022/7674970 |
| work_keys_str_mv | AT shuyunhuo analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages AT yanli analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages AT xiaoyonglei analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages AT zhesun analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages AT heyuanyu analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages AT binghengli analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages AT lidanfang analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages AT shaojiexu analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages AT ningjin analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages AT erpingli analysisofanovelresistivefilmabsorberforsuppressionofelectromagneticradiationinsysteminpackages |