Research Progress on Thermal Management of Electronic Devices Based on Flat Heat Pipe Technology
With the continued miniaturization and high integration of electronic devices, the challenge of heat dissipation caused by the excessive power consumption of electronic devices needs to be resolved urgently. An effective thermal management solution is proposed for heat dissipation in high-power elec...
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| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Journal of Refrigeration Magazines Agency Co., Ltd.
2024-01-01
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| Series: | Zhileng xuebao |
| Subjects: | |
| Online Access: | http://www.zhilengxuebao.com/thesisDetails#10.3969/j.issn.0253-4339.2024.03.001 |
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