Mechanism of ultrasonic field on the particle micro-agglomeration and interfacial bonding of SiCp/7085 composites

SiCp/7085 composites with 10% particle volume fraction was prepared by a semi-solid mixture-mechanical stirring-ultrasound vibrations method. The particle distribution and interface bonding were studied through optical microscopy (OM), scanning electron microscopy (SEM) and X-ray diffraction (XRD),...

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Bibliographic Details
Main Authors: WANG Kun, ZHANG Li-hua, LI Zheng-hua, JIANG Wen, LI Chang-zi
Format: Article
Language:zho
Published: Science Press 2017-02-01
Series:工程科学学报
Subjects:
Online Access:http://cje.ustb.edu.cn/article/doi/10.13374/j.issn2095-9389.2017.02.011
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