Material and constitutive parameters of various Pb-based and Pb-free solders and other interconnection materials: A collective review
Finite element simulations are broadly used for analyzing the mechanical behavior of interconnections in electronic assemblies. The accuracy of these simulations depends heavily on the fidelity of the mechanical properties of the materials and the constitutive models employed. While numerous materia...
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2025-06-01
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| Series: | Results in Engineering |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2590123025016883 |
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