Human–AI collaboration for modeling heat conduction in nanostructures

Abstract Materials informatics, which combines data science and artificial intelligence (AI), has garnered significant attention owing to its ability to accelerate material development. However, human involvement is often limited to the initiation and oversight of machine learning processes and rare...

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Bibliographic Details
Main Authors: Wenyang Ding, Jiang Guo, Meng An, Koji Tsuda, Junichiro Shiomi
Format: Article
Language:English
Published: Nature Portfolio 2025-05-01
Series:npj Computational Materials
Online Access:https://doi.org/10.1038/s41524-025-01657-8
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