Layout and Thermal Analysis of Power Devices Using a PC/XC
Thermal analysis during the design process is an essential step towards the achievement of high reliability in modern high density hybrid and integrated circuits. Thermal analysis is also essential for modern, high density PCBs. Traditionally, a solution of the thermal problem is obtained by either...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Wiley
1990-01-01
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| Series: | Active and Passive Electronic Components |
| Online Access: | http://dx.doi.org/10.1155/1990/39587 |
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