Interfacial reactions between solid Ni and liquid Sn-Zn alloys
The limitation of the harmful lead-containing solders used in the electronics and other industry applications change lead with another metals. Interfacial reactions between Sn-Zn alloys and Ni substrate after annealing at 400 and 450°C were studied. Three intermetallic compounds Ni3Sn4, T1,...
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| Format: | Article |
| Language: | English |
| Published: |
University of Belgrade, Technical Faculty, Bor
2015-01-01
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| Series: | Journal of Mining and Metallurgy. Section B: Metallurgy |
| Subjects: | |
| Online Access: | http://www.doiserbia.nb.rs/img/doi/1450-5339/2015/1450-53391500021G.pdf |
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