Numerical Analysis for Cost-Effective Temperature Reduction in High-Power Light-Emitting Diodes Using Thermal via Array

Numerical Analysis for Cost-Effective Temperature Reduction in High-Power Light-Emitting Diodes Using Thermal via Array

The dissipation of excessive heat in high-power light-emitting diodes (LEDs) is essential for maintaining luminous efficiency, color stability, and device lifetime. While the incorporation of thermal vias in substrates is commonly used to improve heat dissipation, increasing their number is difficul...

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Bibliographic Details
Main Authors: Yong Jin Hwang, Bo-Yeon Lee, Min Ji Kim, Seung-Chul Park, Kanghee Won, Se-Um Kim
Format: Article
Language:English
Published: MDPI AG 2025-06-01
Series:Applied Sciences
Subjects:
high-power LEDs
thermal vias
heat dissipation
finite element analysis
Online Access:https://www.mdpi.com/2076-3417/15/12/6505
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