Digital Etching of Molybdenum Interconnects Using Plasma Oxidation
Abstract Molybdenum (Mo) has a high potential of becoming the material of choice for sub‐10 nm scale metal structures in future integrated circuits (ICs). Manufacturing at this scale requires exceptional precision and consistency, so many metal processing techniques must be reconsidered. In particul...
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Main Authors: | , , , , , , , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
Wiley-VCH
2025-01-01
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Series: | Advanced Materials Interfaces |
Subjects: | |
Online Access: | https://doi.org/10.1002/admi.202400558 |
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