Interfacial microstructure evolution behavior during plastic deformation bonding of GH4065A superalloy
To clarify the evolution of the interfacial microstructure of GH4065A superalloy during plastic deformation bonding， the GH4065A superalloy is bonded under temperatures of 1050-1110 ℃ with the pressure of 20-40 MPa and a time range of 20-35 min. OM，SEM， and EBSD were employed to characterize the sp...
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| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | zho |
| Published: |
Journal of Materials Engineering
2025-01-01
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| Series: | Cailiao gongcheng |
| Subjects: | |
| Online Access: | https://jme.biam.ac.cn/CN/10.11868/j.issn.1001-4381.2023.000846 |
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