AI image enhancement for failure analysis in 3D quantum information technology
Abstract 3D integration and miniaturization techniques get more widely used in conventional integrated circuits but also represent crucial ingredients for future quantum computing devices. This consolidates the need for efficiently detecting increasingly small defects on wafer size. Here we present...
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| Main Authors: | , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Nature Portfolio
2025-07-01
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| Series: | Scientific Reports |
| Online Access: | https://doi.org/10.1038/s41598-025-08308-4 |
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