APA (7th ed.) Citation

Chung, S., Yeom, H., Kim, C., Kim, Y., Lee, S., Baek, C., & Park, J. Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications. MDPI AG.

Chicago Style (17th ed.) Citation

Chung, Seung-Han, Ho-Sun Yeom, Che-Heung Kim, Yong-Kweon Kim, Seung-Ki Lee, Chang-Wook Baek, and Jae-Hyoung Park. Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications. MDPI AG.

MLA (9th ed.) Citation

Chung, Seung-Han, et al. Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications. MDPI AG.