Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications

Substrate Integrated Waveguide on Glass with Vacuum-Filled Tin Through Glass Vias for Millimeter-Wave Applications

This paper presents a novel approach to fabricate substrate integrated waveguides (SIWs) on glass substrates with tin (Sn) through glass vias (TGVs) tailored for millimeter-wave applications. The fabrication process employs a custom-designed vacuum suctioning system to rapidly fill precise TGV holes...

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Bibliographic Details
Main Authors: Seung-Han Chung, Ho-Sun Yeom, Che-Heung Kim, Yong-Kweon Kim, Seung-Ki Lee, Chang-Wook Baek, Jae-Hyoung Park
Format: Article
Language:English
Published: MDPI AG 2024-12-01
Series:Micromachines
Subjects:
substrate integrated waveguide (SIW)
through glass via (TGV)
tin (Sn) vias
vacuum suctioning system
micromachining
Online Access:https://www.mdpi.com/2072-666X/16/1/12
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