Praful, P., & Bailey, C. Warpage in wafer-level packaging: A review of causes, modelling, and mitigation strategies. Frontiers Media S.A.
Chicago Style (17th ed.) CitationPraful, Pallavi, and Chris Bailey. Warpage in Wafer-level Packaging: A Review of Causes, Modelling, and Mitigation Strategies. Frontiers Media S.A.
MLA (9th ed.) CitationPraful, Pallavi, and Chris Bailey. Warpage in Wafer-level Packaging: A Review of Causes, Modelling, and Mitigation Strategies. Frontiers Media S.A.
Warning: These citations may not always be 100% accurate.