Warpage in wafer-level packaging: a review of causes, modelling, and mitigation strategies
Wafer-level packaging (WLP) is a pivotal semiconductor packaging technology that enables heterogeneously integrated advanced semiconductor packages with high-density electrical interconnections through its efficient and highly reliable manufacturing processes. Within this domain, fan-out wafer-level...
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| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Frontiers Media S.A.
2025-02-01
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| Series: | Frontiers in Electronics |
| Subjects: | |
| Online Access: | https://www.frontiersin.org/articles/10.3389/felec.2024.1515860/full |
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