Microsegregation and Solidification Shrinkage of Copper-Lead Base Alloys
Microsegregation and solidification shrinkage were studied on copper-lead base alloys. A series of solidification experiments was performed, using differential thermal analysis (DTA) to evaluate the solidification process. The chemical compositions of the different phases were measured via energy di...
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Main Authors: | , , |
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Format: | Article |
Language: | English |
Published: |
Wiley
2009-01-01
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Series: | Advances in Materials Science and Engineering |
Online Access: | http://dx.doi.org/10.1155/2009/627937 |
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