Properties and Microstructures of Sn-Bi-X Lead-Free Solders
The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So th...
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| Format: | Article |
| Language: | English |
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Wiley
2016-01-01
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| Series: | Advances in Materials Science and Engineering |
| Online Access: | http://dx.doi.org/10.1155/2016/9265195 |
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| author | Fan Yang Liang Zhang Zhi-quan Liu Su-juan Zhong Jia Ma Li Bao |
| author_facet | Fan Yang Liang Zhang Zhi-quan Liu Su-juan Zhong Jia Ma Li Bao |
| author_sort | Fan Yang |
| collection | DOAJ |
| description | The Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders. |
| format | Article |
| id | doaj-art-76c4275d18f74e70abaee0516ee53bb5 |
| institution | Kabale University |
| issn | 1687-8434 1687-8442 |
| language | English |
| publishDate | 2016-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Advances in Materials Science and Engineering |
| spelling | doaj-art-76c4275d18f74e70abaee0516ee53bb52025-02-03T06:11:43ZengWileyAdvances in Materials Science and Engineering1687-84341687-84422016-01-01201610.1155/2016/92651959265195Properties and Microstructures of Sn-Bi-X Lead-Free SoldersFan Yang0Liang Zhang1Zhi-quan Liu2Su-juan Zhong3Jia Ma4Li Bao5School of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, ChinaSchool of Mechanical and Electrical Engineering, Jiangsu Normal University, Xuzhou 221116, ChinaInstitute of Metal Research, Chinese Academy of Sciences, Shenyang 110016, ChinaState Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, ChinaState Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, ChinaState Key Laboratory of Advanced Brazing Filler Metals & Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, ChinaThe Sn-Bi base lead-free solders are proposed as one of the most popular alloys due to the low melting temperature (eutectic point: 139°C) and low cost. However, they are not widely used because of the lower wettability, fatigue resistance, and elongation compared to traditional Sn-Pb solders. So the alloying is considered as an effective way to improve the properties of Sn-Bi solders with the addition of elements (Al, Cu, Zn, Ga, Ag, In, Sb, and rare earth) and nanoparticles. In this paper, the development of Sn-Bi lead-free solders bearing elements and nanoparticles was reviewed. The variation of wettability, melting characteristic, electromigration, mechanical properties, microstructures, intermetallic compounds reaction, and creep behaviors was analyzed systematically, which can provide a reference for investigation of Sn-Bi base solders.http://dx.doi.org/10.1155/2016/9265195 |
| spellingShingle | Fan Yang Liang Zhang Zhi-quan Liu Su-juan Zhong Jia Ma Li Bao Properties and Microstructures of Sn-Bi-X Lead-Free Solders Advances in Materials Science and Engineering |
| title | Properties and Microstructures of Sn-Bi-X Lead-Free Solders |
| title_full | Properties and Microstructures of Sn-Bi-X Lead-Free Solders |
| title_fullStr | Properties and Microstructures of Sn-Bi-X Lead-Free Solders |
| title_full_unstemmed | Properties and Microstructures of Sn-Bi-X Lead-Free Solders |
| title_short | Properties and Microstructures of Sn-Bi-X Lead-Free Solders |
| title_sort | properties and microstructures of sn bi x lead free solders |
| url | http://dx.doi.org/10.1155/2016/9265195 |
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