Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study
This paper describes an experimental study for the removal of copper ions from electroplating wastewater. Different metal ions are added to the wastewater to remove copper ions by coprecipitation and the copper-based supramolecular materials with layered structures are obtained. It is found that the...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
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Wiley
2016-01-01
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| Series: | Journal of Chemistry |
| Online Access: | http://dx.doi.org/10.1155/2016/5281561 |
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| author | De-Kui Bai Quan-Hong Ying Ni Wang Jin-Hui Lin |
| author_facet | De-Kui Bai Quan-Hong Ying Ni Wang Jin-Hui Lin |
| author_sort | De-Kui Bai |
| collection | DOAJ |
| description | This paper describes an experimental study for the removal of copper ions from electroplating wastewater. Different metal ions are added to the wastewater to remove copper ions by coprecipitation and the copper-based supramolecular materials with layered structures are obtained. It is found that the best results are obtained with the addition of –Mg2+–Al3+ mixture with ratio of 3 : 1, pH ≈ 10, and aging for 1 d at 60°C. With these conditions, the residual copper in the electroplating wastewater satisfies national emission standards and wastewater handling capacity of up to 30 mL can be achieved. The properties of the copper-based supramolecular materials prepared under these optimal conditions are characterized. The results show that the materials have a layered structure and good thermal and structural stability and achieve a saturated adsorption of iodide ions of 41.23 mg/g. |
| format | Article |
| id | doaj-art-72b052e6d856497ca90e9b66e52ab4d8 |
| institution | Kabale University |
| issn | 2090-9063 2090-9071 |
| language | English |
| publishDate | 2016-01-01 |
| publisher | Wiley |
| record_format | Article |
| series | Journal of Chemistry |
| spelling | doaj-art-72b052e6d856497ca90e9b66e52ab4d82025-02-03T05:45:33ZengWileyJournal of Chemistry2090-90632090-90712016-01-01201610.1155/2016/52815615281561Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application StudyDe-Kui Bai0Quan-Hong Ying1Ni Wang2Jin-Hui Lin3College of Materials and Chemistry and Chemical Engineering, Chengdu University of Technology, Chengdu 610059, ChinaMianyang Product Quality Supervision and Inspection Institute, Mianyang 621000, ChinaMianyang Product Quality Supervision and Inspection Institute, Mianyang 621000, ChinaCollege of Materials and Chemistry and Chemical Engineering, Chengdu University of Technology, Chengdu 610059, ChinaThis paper describes an experimental study for the removal of copper ions from electroplating wastewater. Different metal ions are added to the wastewater to remove copper ions by coprecipitation and the copper-based supramolecular materials with layered structures are obtained. It is found that the best results are obtained with the addition of –Mg2+–Al3+ mixture with ratio of 3 : 1, pH ≈ 10, and aging for 1 d at 60°C. With these conditions, the residual copper in the electroplating wastewater satisfies national emission standards and wastewater handling capacity of up to 30 mL can be achieved. The properties of the copper-based supramolecular materials prepared under these optimal conditions are characterized. The results show that the materials have a layered structure and good thermal and structural stability and achieve a saturated adsorption of iodide ions of 41.23 mg/g.http://dx.doi.org/10.1155/2016/5281561 |
| spellingShingle | De-Kui Bai Quan-Hong Ying Ni Wang Jin-Hui Lin Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study Journal of Chemistry |
| title | Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study |
| title_full | Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study |
| title_fullStr | Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study |
| title_full_unstemmed | Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study |
| title_short | Copper Removal from Electroplating Wastewater by Coprecipitation of Copper-Based Supramolecular Materials: Preparation and Application Study |
| title_sort | copper removal from electroplating wastewater by coprecipitation of copper based supramolecular materials preparation and application study |
| url | http://dx.doi.org/10.1155/2016/5281561 |
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