Effect of Beam Power on Intermetallic Compound Formation of Electron Beam-Welded Cu and Al6082-T6 Dissimilar Joints
In this work, electron beam welds between Cu and Al plates were formed using different power modes, namely 1800 W, 2400 W, and 3000 W. The structure, microhardness, and tensile strength of the raw materials and the weld seams were studied. The low power of the electron beam resulted in the improper...
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2025-01-01
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author | Darina Kaisheva Georgi Kotlarski Maria Ormanova Borislav Stoyanov Vladimir Dunchev Angel Anchev Stefan Valkov |
author_facet | Darina Kaisheva Georgi Kotlarski Maria Ormanova Borislav Stoyanov Vladimir Dunchev Angel Anchev Stefan Valkov |
author_sort | Darina Kaisheva |
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description | In this work, electron beam welds between Cu and Al plates were formed using different power modes, namely 1800 W, 2400 W, and 3000 W. The structure, microhardness, and tensile strength of the raw materials and the weld seams were studied. The low power of the electron beam resulted in the improper penetration and insufficient depth of the weld seam. The low power resulted in high cooling rates, which hindered the nucleation of the copper and aluminum particles. A number of intermetallic compounds (IMCs) were formed, including the metastable Cu<sub>9</sub>Al<sub>4</sub> one. An increase in the power of the electron beam reduced the cooling rate and increased the miscibility between the materials. This resulted in the formation of a mostly homogeneous structure comprising an αAl solid solution and dendritic eutectic CuAl<sub>2</sub> intermetallic compounds. A preferred crystallographic orientation of the aluminum phase was detected regarding the sample prepared using a power of 3000 W, forming a specific texture towards the {111} family of crystallographic planes, which is the closest-packed structure. This plane characterizes the highest chemical activity and the highest plasticity. As a result, this sample exhibited the best chemical bonding between the IMCs and the aluminum matrix and the best microhardness and tensile test values. |
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institution | Kabale University |
issn | 2673-4117 |
language | English |
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spelling | doaj-art-71ee80a84d6b48329010395e384c5c3a2025-01-24T13:31:33ZengMDPI AGEng2673-41172025-01-0161610.3390/eng6010006Effect of Beam Power on Intermetallic Compound Formation of Electron Beam-Welded Cu and Al6082-T6 Dissimilar JointsDarina Kaisheva0Georgi Kotlarski1Maria Ormanova2Borislav Stoyanov3Vladimir Dunchev4Angel Anchev5Stefan Valkov6Institute of Electronics, Bulgarian Academy of Sciences, 72 Tzarigradsko Chausse Blvd, 1784 Sofia, BulgariaInstitute of Electronics, Bulgarian Academy of Sciences, 72 Tzarigradsko Chausse Blvd, 1784 Sofia, BulgariaInstitute of Electronics, Bulgarian Academy of Sciences, 72 Tzarigradsko Chausse Blvd, 1784 Sofia, BulgariaDepartment of Industrial Design and Textile Engineering, Technical University of Gabrovo, 4 H. Dimitar Str., 5300 Gabrovo, BulgariaDepartment of Material Science and Mechanics of Materials, Technical University of Gabrovo, 4 H. Dimitar Str., 5300 Gabrovo, BulgariaDepartment of Material Science and Mechanics of Materials, Technical University of Gabrovo, 4 H. Dimitar Str., 5300 Gabrovo, BulgariaInstitute of Electronics, Bulgarian Academy of Sciences, 72 Tzarigradsko Chausse Blvd, 1784 Sofia, BulgariaIn this work, electron beam welds between Cu and Al plates were formed using different power modes, namely 1800 W, 2400 W, and 3000 W. The structure, microhardness, and tensile strength of the raw materials and the weld seams were studied. The low power of the electron beam resulted in the improper penetration and insufficient depth of the weld seam. The low power resulted in high cooling rates, which hindered the nucleation of the copper and aluminum particles. A number of intermetallic compounds (IMCs) were formed, including the metastable Cu<sub>9</sub>Al<sub>4</sub> one. An increase in the power of the electron beam reduced the cooling rate and increased the miscibility between the materials. This resulted in the formation of a mostly homogeneous structure comprising an αAl solid solution and dendritic eutectic CuAl<sub>2</sub> intermetallic compounds. A preferred crystallographic orientation of the aluminum phase was detected regarding the sample prepared using a power of 3000 W, forming a specific texture towards the {111} family of crystallographic planes, which is the closest-packed structure. This plane characterizes the highest chemical activity and the highest plasticity. As a result, this sample exhibited the best chemical bonding between the IMCs and the aluminum matrix and the best microhardness and tensile test values.https://www.mdpi.com/2673-4117/6/1/6electron beam weldingintermetallic compoundsdissimilar metalsaluminum alloycopperbeam current |
spellingShingle | Darina Kaisheva Georgi Kotlarski Maria Ormanova Borislav Stoyanov Vladimir Dunchev Angel Anchev Stefan Valkov Effect of Beam Power on Intermetallic Compound Formation of Electron Beam-Welded Cu and Al6082-T6 Dissimilar Joints Eng electron beam welding intermetallic compounds dissimilar metals aluminum alloy copper beam current |
title | Effect of Beam Power on Intermetallic Compound Formation of Electron Beam-Welded Cu and Al6082-T6 Dissimilar Joints |
title_full | Effect of Beam Power on Intermetallic Compound Formation of Electron Beam-Welded Cu and Al6082-T6 Dissimilar Joints |
title_fullStr | Effect of Beam Power on Intermetallic Compound Formation of Electron Beam-Welded Cu and Al6082-T6 Dissimilar Joints |
title_full_unstemmed | Effect of Beam Power on Intermetallic Compound Formation of Electron Beam-Welded Cu and Al6082-T6 Dissimilar Joints |
title_short | Effect of Beam Power on Intermetallic Compound Formation of Electron Beam-Welded Cu and Al6082-T6 Dissimilar Joints |
title_sort | effect of beam power on intermetallic compound formation of electron beam welded cu and al6082 t6 dissimilar joints |
topic | electron beam welding intermetallic compounds dissimilar metals aluminum alloy copper beam current |
url | https://www.mdpi.com/2673-4117/6/1/6 |
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