APA (7th ed.) Citation

Park, J., Son, C., Son, Y., & Hwang, D. Effect of Process Pressure on the Properties of Cu<sub>2</sub>O Thin Films Deposited by RF Magnetron Sputtering. MDPI AG.

Chicago Style (17th ed.) Citation

Park, Junghwan, Chang-Sik Son, Young-Guk Son, and Donghyun Hwang. Effect of Process Pressure on the Properties of Cu<sub>2</sub>O Thin Films Deposited by RF Magnetron Sputtering. MDPI AG.

MLA (9th ed.) Citation

Park, Junghwan, et al. Effect of Process Pressure on the Properties of Cu<sub>2</sub>O Thin Films Deposited by RF Magnetron Sputtering. MDPI AG.

Warning: These citations may not always be 100% accurate.