Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing

Modeling and Simulation for Predicting Thermo-Mechanical Behavior of Wafer-Level Cu-PI RDLs During Manufacturing

The development of chip manufacturing and advanced packaging technologies has significantly changed redistribution layers (RDLs), leading to shrinking line width/spacing, increasing the number of build-up layers and package size, and introducing organic materials such as polyimide (PI) for dielectri...

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Bibliographic Details
Main Authors: Xianglong Chu, Shitao Wang, Chunlei Li, Zhizhen Wang, Shenglin Ma, Daowei Wu, Hai Yuan, Bin You
Format: Article
Language:English
Published: MDPI AG 2025-05-01
Series:Micromachines
Subjects:
equivalent model
redistribution layer
wafer-level model
thermo-mechanical
polyimide
layout effect
Online Access:https://www.mdpi.com/2072-666X/16/5/582
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