A 3D DC Electric Field Meter Based on Sensor Chips Packaged Using a Highly Sensitive Scheme

A 3D DC Electric Field Meter Based on Sensor Chips Packaged Using a Highly Sensitive Scheme

This study presents a 3D DC electric field meter (EFM) that uses three identical 1D MEMS chips. The shielding electrodes and sensing electrodes of the MEMS chips employ a combination of rigid frames and short strip-type beams to improve vibrational stability. To enhance sensitivity, our MEMS chips f...

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Bibliographic Details
Main Authors:	Pengfei Yang, Xiaolong Wen, Xiaonan Li, Zhaozhi Chu, Chunrong Peng, Shuang Wu
Format:	Article
Language:	English
Published:	MDPI AG 2025-04-01
Series:	Micromachines
Subjects:	MEMS 3D electric field meter sensor chips moistureproof packaging structure highly sensitive package
Online Access:	https://www.mdpi.com/2072-666X/16/4/484
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