Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces

Abstract Increasing the proximity of microelectrode arrays (MEA) to targeted neural tissues can establish efficient neural interfaces for both recording and stimulation applications. This has been achieved by constructing protruding three-dimensional (3D) structures on top of conventional planar mic...

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Main Authors: Dong Hyeon Lee, Younghoon Park, Yoon Seo, Hannah Noh, Hyunbeen Jeong, Jongmo Seo, Min-Ho Seo, Kyungsik Eom, Joonsoo Jeong
Format: Article
Language:English
Published: Nature Portfolio 2025-01-01
Series:npj Flexible Electronics
Online Access:https://doi.org/10.1038/s41528-024-00378-0
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author Dong Hyeon Lee
Younghoon Park
Yoon Seo
Hannah Noh
Hyunbeen Jeong
Jongmo Seo
Min-Ho Seo
Kyungsik Eom
Joonsoo Jeong
author_facet Dong Hyeon Lee
Younghoon Park
Yoon Seo
Hannah Noh
Hyunbeen Jeong
Jongmo Seo
Min-Ho Seo
Kyungsik Eom
Joonsoo Jeong
author_sort Dong Hyeon Lee
collection DOAJ
description Abstract Increasing the proximity of microelectrode arrays (MEA) to targeted neural tissues can establish efficient neural interfaces for both recording and stimulation applications. This has been achieved by constructing protruding three-dimensional (3D) structures on top of conventional planar microelectrodes via additional micromachining steps. However, this approach adds fabrication complexities and limits the 3D structures to certain shapes. We propose a one-step fabrication of MEAs with versatile microscopic 3D structures via “microelectrothermoforming (μETF)” of thermoplastics, by utilizing 3D-printed molds to locally deform planar MEAs into protruding and recessing shapes. Electromechanical optimization enabled a 3D MEA with 80 μm protrusions and/or recession for 100 μm diameter. Its simple and versatile shaping capabilities are demonstrated by diverse 3D structures on a single MEA. The benefits of 3D MEA are evaluated in retinal stimulation through numerical simulations and ex vivo experiments, confirming a threshold lowered by 1.7 times and spatial resolution enhanced by 2.2 times.
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institution Kabale University
issn 2397-4621
language English
publishDate 2025-01-01
publisher Nature Portfolio
record_format Article
series npj Flexible Electronics
spelling doaj-art-5e574f26e21c44d5b9d91ca148a1564c2025-01-26T12:57:40ZengNature Portfolionpj Flexible Electronics2397-46212025-01-019111310.1038/s41528-024-00378-0Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfacesDong Hyeon Lee0Younghoon Park1Yoon Seo2Hannah Noh3Hyunbeen Jeong4Jongmo Seo5Min-Ho Seo6Kyungsik Eom7Joonsoo Jeong8School of Mechanical Engineering, Pusan National UniversityDepartment of Electronics Engineering, College of Engineering, Pusan National UniversityDepartment of Information Convergence Engineering, Pusan National UniversityDepartment of Information Convergence Engineering, Pusan National UniversityDepartment of Electrical and Computer Engineering, Seoul National UniversityDepartment of Electrical and Computer Engineering, Seoul National UniversityDepartment of Information Convergence Engineering, Pusan National UniversityDepartment of Electronics Engineering, College of Engineering, Pusan National UniversityDepartment of Information Convergence Engineering, Pusan National UniversityAbstract Increasing the proximity of microelectrode arrays (MEA) to targeted neural tissues can establish efficient neural interfaces for both recording and stimulation applications. This has been achieved by constructing protruding three-dimensional (3D) structures on top of conventional planar microelectrodes via additional micromachining steps. However, this approach adds fabrication complexities and limits the 3D structures to certain shapes. We propose a one-step fabrication of MEAs with versatile microscopic 3D structures via “microelectrothermoforming (μETF)” of thermoplastics, by utilizing 3D-printed molds to locally deform planar MEAs into protruding and recessing shapes. Electromechanical optimization enabled a 3D MEA with 80 μm protrusions and/or recession for 100 μm diameter. Its simple and versatile shaping capabilities are demonstrated by diverse 3D structures on a single MEA. The benefits of 3D MEA are evaluated in retinal stimulation through numerical simulations and ex vivo experiments, confirming a threshold lowered by 1.7 times and spatial resolution enhanced by 2.2 times.https://doi.org/10.1038/s41528-024-00378-0
spellingShingle Dong Hyeon Lee
Younghoon Park
Yoon Seo
Hannah Noh
Hyunbeen Jeong
Jongmo Seo
Min-Ho Seo
Kyungsik Eom
Joonsoo Jeong
Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces
npj Flexible Electronics
title Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces
title_full Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces
title_fullStr Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces
title_full_unstemmed Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces
title_short Microelectrothermoforming (μETF): one-step versatile 3D shaping of flexible microelectronics for enhanced neural interfaces
title_sort microelectrothermoforming μetf one step versatile 3d shaping of flexible microelectronics for enhanced neural interfaces
url https://doi.org/10.1038/s41528-024-00378-0
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